The design and testing of reliable semiconductor materials face several challenges and limitations. Key issues include material compatibility, process integration, reliability, and scalability. Compatibility challenges arise from the diverse properties of materials, necessitating careful interface engineering and process optimization. Reliability concerns, such as electromigration and stress migration, are addressed through advanced characterization techniques and reliability testing. Scalability challenges, particularly for emerging materials, require the development of scalable synthesis and deposition techniques. Researchers are addressing these issues through collaborative efforts, advanced process control, and the integration of data analytics and machine learning to optimize processes and predict yield issues.
Shiromani Balmukund Rahi, Young Suh Song, Laxman Raju Thoutam, T. S. Arun Samuel, Shubam Tayal